eASIC announces Low Density Sales Campaign

February 11, 2010

eASIC has announced a Sales Campaign focused on its Front -End ASICin a Box and Design Services Program,this limited time Campaign will allow users of a range of Low Density FPGA’s acess to eASIC’s 90nm NX750 andNX1500 devices and design services at highly attractive price points for bothDesign Translations to eASIC technology,prototype parts and productionquantities of the devices.This program will yield significant cost savingsto companies by reducing their BOM cost for critical components.

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