eASIC announces Low Density Sales Campaign
eASIC has announced a Sales Campaign focused on its Front -End ASICin a Box and Design Services Program,this limited time Campaign will allow users of a range of Low Density FPGA’s acess to eASIC’s 90nm NX750 andNX1500 devices and design services at highly attractive price points for bothDesign Translations to eASIC technology,prototype parts and productionquantities … Continue reading eASIC announces Low Density Sales Campaign
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